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Arisentec® delivers end-to-end PCB design, fabrication, assembly, and box build solutions for high-mix, low-volume to high-volume production. Trusted by 3,000+ global clients across 30+ countries.
Founded in 2011 and headquartered in Shenzhen, China, Arisentec has grown into one of the leading PCB manufacturers in Asia, serving over 3,000 global customers across 30+ countries.
We specialize in providing comprehensive electronic manufacturing services (EMS), including PCB design, fabrication, component sourcing, PCBA, cable assembly, and full turnkey solutions. Our mission is to empower innovation through reliable, high-quality, and cost-effective manufacturing.
From concept to production, Arisentec offers a complete suite of electronic manufacturing services tailored to your project’s needs.
Full-cycle PCB design support including schematic capture, layout, signal integrity analysis, and DFM optimization.
High-quality fabrication for single-sided, multilayer, HDI, ELIC, VIPPO, rigid-flex, and flex PCBs with tight tolerances.
SMT, THT, mixed-technology assembly with AOI, X-ray inspection, and functional testing for reliability.
Custom wire harnesses, cable assemblies, and connectors for industrial, medical, and automotive applications.
Complete product integration, box build, and packaging solutions for ready-to-ship end products.
CNC machining, injection molding, and sheet metal fabrication for enclosures and structural parts.
Advanced technologies to meet the most demanding design requirements.
High Density Interconnect with microvias and fine pitch components.
Combines rigid and flexible substrates for compact 3D designs.
Every Layer Interconnect for ultra-high layer count boards.
VIPPO technology for improved thermal and electrical performance.
Removes stubs in high-speed designs to reduce signal loss.
Ultra-thin, bendable circuits for space-constrained applications.
Up to 32 layers with controlled impedance and blind/buried vias.
Rogers, Teflon, and other RF materials for 5G and telecom.
Tailored PCB and PCBA solutions for mission-critical applications.
High-reliability PCBs for diagnostic devices, patient monitors, and surgical equipment.
Compact, low-power PCBs for IoT sensors, smart lighting, and voice-controlled devices.
Ruggedized PCBs for automation, motor control, and high-temperature environments.
AEC-Q200 compliant PCBs for ADAS, infotainment, and powertrain systems.
High-speed digital PCBs for servers, printers, and networking equipment.
Cost-optimized, high-volume PCBs for wearables, audio devices, and smart gadgets.
RF and microwave PCBs for 5G, base stations, and satellite communication.
Miniaturized, low-power PCBs for edge computing and wireless sensor networks.
We manufacture single-sided, double-sided, multilayer, HDI, ELIC, rigid-flex, flex, and high-frequency PCBs using materials like FR-4, Rogers, and polyimide.
Yes, we provide full turnkey solutions including component sourcing, PCB fabrication, assembly, testing, and packaging.
Prototype: 5–7 days; Production: 10–15 days depending on complexity and volume.
Yes, our facilities are ISO 9001 certified and follow IPC-A-610 standards for PCB assembly.
Reach out to our team for quotes, technical support, or partnership opportunities.
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