Precision BGA PCB Manufacturing

With 20 years of expertise in BGA circuit board manufacturing, we deliver high-reliability, multilayer, HDI, rigid-flex, and high-speed PCBs for FPV drones, medical devices, automotive electronics, and 5G communication systems.

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20+ Years

BGA PCB Manufacturing Expertise

6–40 Layers

Multilayer HDI & Complex Stackups

Global Clients

Serving FPV, Medical, Automotive & Telecom

Trusted PCB Manufacturer Since 2003

BGA Board has been a leader in high-precision PCB manufacturing for over two decades. We specialize in BGA (Ball Grid Array) circuit boards, delivering unmatched reliability and performance for mission-critical applications.

Our philosophy is simple: “Do It Right the First Time.” We combine advanced technology with strict inspection standards to ensure every PCB meets the highest quality benchmarks.

7+ Years FPV Drone PCB Experience

Specialized in high-current, fast-response flight controllers and ESCs.

ISO 13485 & CNAS Certified

Compliant with medical and automotive safety standards.

Up to 40-Layer PCBs

Advanced HDI and blind/buried via technology.

Heavy Copper ≥ 105μm

Ideal for high-power and thermal management applications.

Our Product Range

High-performance PCBs engineered for reliability, speed, and precision across industries.

Multilayer HDI PCB

High-Density Interconnect boards with blind and buried vias. Ideal for compact, high-speed digital systems.

• 6–40 layer stackups
• Microvias & sequential lamination
• Impedance-controlled designs
• BGA pitch down to 0.4mm

Rigid-Flex PCB

Combines rigid and flexible substrates for 3D packaging in medical, aerospace, and wearable tech.

• Up to 6-layer flex sections
• Dynamic flex cycling tested
• RoHS & lead-free compatible
• Ideal for space-constrained devices

High Frequency PCB

RF and microwave circuits using Rogers, Teflon, and other low-loss materials for 5G and radar.

• Rogers 4000, 5000, Taconic
• Millimeter wave up to 100GHz
• Tight Dk/Df tolerance
• SI/PI optimized

High-Speed PCB

Designed for optical modules, 5G backplanes, and high-speed digital communication.

• 25+ Gbps signal integrity
• TDR/VNA verified
• Low skew differential pairs
• Backplane and midplane designs

Thick Copper PCB

Heavy copper boards (3oz to 20oz) for power electronics, motor drives, and thermal management.

• Copper thickness up to 4OZ+
• High current & thermal dissipation
• Plated through holes for heat transfer
• Ideal for ESCs and power supplies

FPV Drone PCB

High-reliability flight controllers and ESCs with fast response and low internal resistance.

• 3oz to 6oz copper
• High-voltage resistance
• Low ESR & inductance
• Vibration and shock tested

IC Substrate (Carrier Board)

Advanced packaging substrates for BGA, CSP, and flip-chip applications.

• Ultra-fine lines & spaces
• High layer count
• Low CTE materials
• High reliability under thermal cycling

Ceramic PCB

Aluminum nitride and alumina substrates for high-thermal-conductivity applications.

• Thermal conductivity up to 170 W/mK
• Hermetic sealing
• Used in LED, power, and RF modules
• CTE matched to silicon

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Key Application Areas

Engineered for performance in critical industries.

FPV Drone Electronics

We manufacture high-performance flight controllers and ESCs with:

• High reliability under extreme conditions
• Fast response for large current bursts
• Low internal resistance for efficiency
• High voltage resistance and thermal stability

Medical Equipment PCBs

Certified and compliant with medical standards:

• ISO 13485 & ISO 17025/CNAS certified
• Rigid-flex up to 6-layer flex
• Strict impedance and EMC control
• Participation in customer design phase

Automotive Electronics

Built for safety and longevity in vehicles:

• Reliability and traceability tracking
• Heavy copper ≥ 105μm
• Advanced thermal management
• HDI for compact ECUs and sensors

Communication Equipment

Supporting next-gen telecom infrastructure:

• Up to 40-layer boards
• 5G antenna and mmWave support
• SI control with TDR/VNA validation
• High-speed digital and RF hybrid designs

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