Precision PCB Manufacturing for the Future

8-Layer PCB with BGA & Golden Fingers

• • High-density interconnect design
• • BGA support with tight pitch
• • Gold-plated edge connectors
• • Ideal for industrial and telecom

6-Layer Impedance-Controlled PCB

• • Controlled impedance traces
• • High-speed signal integrity
• • Red or blue soldermask options
• • Suitable for networking devices

2-Layer Rigid-Flex PCB

• • Hybrid rigid and flexible sections
• • Space-saving 3D integration
• • Ideal for wearable and medical
• • Durable under repeated flexing

6-Layer Blind Via PCB

• • Blind and buried vias
• • Blind and countersunk slots
• • High routing density
• • Used in aerospace and defense

4-Layer PCB with Blind Vias

• • Compact multilayer design
• • Blind vias for space efficiency
• • High reliability
• • Perfect for compact electronics

2-Layer PCB with Bonding IC

• • Direct chip-on-board bonding
• • Minimal footprint
• • High thermal stability
• • Used in sensors and modules

Aluminum PCB

Thermally efficient metal-core boards for high-power applications.

• • Excellent heat dissipation
• • Used in LED lighting & power supplies
• • Dielectric insulation layer
• • Long lifespan under thermal stress

HDI PCB

High-Density Interconnect boards for miniaturized electronics.

• • Microvias and fine lines
• • Ideal for smartphones & IoT
• • Enhanced signal performance
• • Stack-up and build-up options

Flexible PCB (FPC)

Bendable circuits for dynamic and compact designs.

• • Polyimide or PET base
• • Dynamic flexing capability
• • Lightweight and space-saving
• • Used in cameras and foldables