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HMX Electronics Co., Ltd. is a trusted PCB and PCBA manufacturer based in China, delivering high-quality, low-to-medium volume circuit board solutions since 2015. With facilities in Shenzhen and Jiangxi, we combine fast turnaround, advanced technology, and cost-effective production for global clients.
A trusted name in PCB and PCBA manufacturing, delivering precision and reliability since 2015.
Hongkong Hemeixin Electronics Co., Limited is a leading professional PCB and PCBA manufacturer established in 2015 and headquartered in China. With dedicated low and medium-volume PCB factories and an SMT assembly facility in Shenzhen, along with a mixed-volume PCB production base in Jiangxi Province, we provide comprehensive electronic manufacturing services tailored to diverse client needs.
Our Shenzhen facility emphasizes fast delivery and high quality, ideal for prototyping and small-batch production. The Jiangxi factory offers cost-effective solutions for higher-volume orders, ensuring flexibility and scalability for our global customers.
From 4-layer prototypes to 30-layer HDI boards, we manufacture high-reliability PCBs for industrial, medical, automotive, and communication applications.
Ideal for prototypes and mid-complexity designs with improved signal integrity.
Enhanced routing and power distribution for complex embedded systems.
High-density interconnect for advanced computing and networking hardware.
Robust solution for high-speed digital and RF applications.
Engineered for aerospace, defense, and industrial control systems.
Maximum routing density with advanced stack-up design and signal integrity.
Specialized for high-performance computing and telecom infrastructure.
Cutting-edge multilayer technology for mission-critical applications.
Equipped with state-of-the-art machinery and processes to ensure precision, reliability, and consistency across all production stages.
High-speed pick-and-place machines with 01005 component support, reflow soldering, and AOI inspection for flawless PCBA.
Laser and mechanical drilling down to 0.1mm, with high aspect ratio plating for reliable multilayer interconnects.
X-ray, AOI, flying probe, and functional testing ensure every board meets IPC Class 2/3 standards.
Tight tolerance impedance management with TDR validation for high-speed signal integrity.
Thick copper, thermal vias, and metal core PCBs for high-power and LED applications.
Full BOM sourcing, component kitting, assembly, testing, and packaging under one roof.
Reach out to our team for quotes, technical support, or manufacturing consultations.
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