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Kartain Technology delivers high-performance IC Substrate PCBs, HDI, Aluminum, FR4, FPC, and full turnkey PCB assembly solutions from Shenzhen. Engineered for reliability, speed, and thermal efficiency.
Explore ProductsKartain Technology CO., LTD specializes in advanced printed circuit board solutions including IC Substrate PCBs, HDI, Multilayer, Aluminum, FR4, and Flexible PCBs. With years of experience and a commitment to quality, we serve global clients in lighting, telecommunications, consumer electronics, and industrial applications.
Our facility is equipped with state-of-the-art equipment for PCB fabrication and SMT assembly, ensuring precision down to 2mil lines and 0.05mm pads. We maintain strict quality control standards and offer quick-turn prototyping and volume production.
Years Experience
Global Clients
Max Layers
Min Line Width
From IC substrates to high-frequency RF boards, Kartain offers a comprehensive portfolio of advanced PCB technologies.
High-density interconnect substrates for advanced semiconductor packaging including UDP, CSP, SIP, LGA, PBGA, and SSD packages.
High-Density Interconnect and multilayer boards from 4 to 60 layers with microvias and buried vias.
Thermally efficient metal-core PCBs with aluminum (1.0–8.0W/mK) and copper bases for LED and power applications.
Reliable FR4 PCBs for general electronics, available in 4, 6, 8, and 10–20 layer configurations.
Flexible printed circuits for compact and dynamic applications, including LED strips and wearable devices.
High-frequency boards using Rogers, Teflon (PTFE), Taconic, F4B, Isola, and Arlon materials.
High thermal conductivity ceramic substrates for power modules, LEDs, and high-reliability applications.
Full SMT and thru-hole assembly services with component sourcing, stencil printing, and testing.
Kartain combines cutting-edge equipment with rigorous quality systems to deliver precision PCBs on time and to specification.
An IC Substrate PCB is a high-density interconnect board used as a carrier for semiconductor chips in packages like BGA, CSP, and SIP. It provides electrical connections, thermal dissipation, and mechanical support at the chip level.
We offer Rogers (e.g., RO4350B), Teflon (PTFE), Taconic, F4B, Isola, and Arlon materials for high-frequency applications. These are ideal for antennas, 5G, and microwave circuits.
Yes, we offer quick-turn services with options for 24-hour, 48-hour, and 5-day turnaround for both prototypes and small-volume production.
Yes, we have specialized capabilities for ultra-thin PCBs down to 0.3mm thickness, suitable for compact and lightweight electronic devices.
Contact Kartain Technology for quotes, technical support, or custom PCB solutions.
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