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Professional Thermal Management Solutions for Electronics, LED, Computing, and Industrial Applications
Shenzhen Aochuan Technology Co., Ltd is a world leader in the research and manufacturing of thermal interface materials (TIMs). We provide a complete family of interface materials to meet the critical needs of a rapidly changing electronics industry.
We have developed a comprehensive range of choices for thermal interface materials including thermal grease, thermally conductive gap fillers, thermal conductive insulators, and phase change materials.
Our products have passed CE, GS, and UL certifications. Our company is ISO9001, ISO14001, and ITS certified. We have helped over 5,000 companies enhance product performance, appearance, and production efficiency.
Engineered for performance, reliability, and efficiency in demanding thermal environments.
High thermal conductivity, minimal bondline thickness, superior surface wetting. Stable through reliability testing.
Eliminate air gaps, conform to surface warps, compressible, stress-free with shock absorption.
Electrically insulating with high thermal transfer. Ideal for high-performance isolation needs.
Optimized thermal performance through phase transition. Ideal for dynamic thermal loads.
Efficient mounting solution for heat sinks on microprocessors, panel PCs, and small electronics.
Versatile thermal interface solution for various electronic components and heat dissipation needs.
Fill large air gaps between components and heat sinks. High conformability and low compression force.
Advanced materials engineered for extreme environments and high-reliability applications.
Engineered to solve real-world thermal challenges across industries.
Efficient thermal solutions for networking equipment to ensure stable performance under continuous load.
Optimal thermal management for LED drivers and heat sinks to extend lifespan and maintain brightness.
Advanced materials and application techniques to minimize thermal resistance in electronic assemblies.
High-performance thermal interface materials for CPUs, GPUs, and other high-power semiconductor devices.
Robust thermal solutions for industrial control systems, power supplies, and motor drives.
Compact, reliable thermal management for smartphones, tablets, and wearable devices.
Our materials are trusted in diverse applications across the electronics industry.
All products undergo rigorous testing to meet international safety and performance standards.
Find answers to common questions about thermal interface materials.
A thermal interface material fills microscopic air gaps between a heat source (like a CPU) and a heat sink, improving thermal conductivity and reducing operating temperatures.
Thermal grease offers the highest conductivity but can be messy. Thermal pads are easier to handle and rework, ideal for volume manufacturing and applications requiring mechanical stability.
High-quality TIMs like those from Lintechm are designed to remain stable through thousands of thermal cycles without drying out or pump-out.
Many of our products, especially thermally conductive insulators and certain gap pads, are electrically insulating while providing excellent thermal transfer.
For product inquiries, technical support, or to request free samples, please visit our official website.
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