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Delivering high-performance 355nm, 532nm, and 1064nm lasers for semiconductor, diamond, automotive, and advanced manufacturing applications.
Maiman Laser is a leading industrial laser solutions provider, specializing in high-precision UV, green, and infrared lasers for advanced manufacturing and material processing.
With cutting-edge technologies in solid-state MOPA amplification, nonlinear frequency conversion, and ultrafast microchip chirp amplification, we deliver reliable, high-performance laser systems trusted across industries.
Engineered for precision, durability, and performance across semiconductor, diamond, electronics, and industrial applications.
High single pulse energy lasers ideal for semiconductor processing.
Designed for ultra-precise diamond and super-hard material processing.
Versatile marking and engraving for diverse industrial materials.
Advanced 355nm UV technology with enhanced durability and beam quality.
Microchip chirp amplification for stable, cost-effective ultrafast pulses.
Solid-state MOPA with nonlinear frequency conversion for multi-wavelength output.
Tailored for SiC and silicon wafer scribing and dicing.
Precision tools for diamond cutting, engraving, and jewelry marking.
Maiman Laser leverages proprietary advancements in solid-state and ultrafast laser systems to deliver unmatched performance and reliability.
Enhanced LBO crystal damage threshold extends UV laser lifetime while maintaining excellent beam quality for precision applications.
Solves traditional ultrafast laser issues of short lifespan and poor beam quality, while significantly reducing system cost.
Delivers high beam quality, multi-wavelength (355/532/1064nm), and hundred-watt-level output for diverse industrial processing.
Maiman lasers are trusted across high-tech industries for precision, reliability, and performance.
SiC wafer scribing, solar cell processing, battery manufacturing.
PCB/FPC marking, 3C product engraving, ITO film etching.
Diamond slicing, internal engraving, jewelry marking.
Part marking, sensor manufacturing, lightweight material cutting.
Hard material cutting, PCD/PcBN tool processing.
High-speed marking on plastics, films, and containers.
Precision cutting of medical devices and implants.
Laser sintering, metal powder processing, additive manufacturing.
Maiman lasers provide 355nm (UV), 532nm (green), and 1064nm (infrared) wavelengths, optimized for different material processing needs.
Our lasers are widely used in semiconductor, diamond & jewelry, automotive, consumer electronics, medical, and packaging industries.
Yes, our ultrafast microchip chirp amplification technology enables picosecond and femtosecond pulse generation for high-precision applications.
Yes, we provide comprehensive customer support, application videos, and downloadable product brochures on our official website.
For product inquiries, technical support, or partnership opportunities, visit our official website.
Visit Official Website86-22-87894217
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