Our Product Range
Engineered for performance, durability, and precision in high-grade electronic applications.
FR4 Copper Clad Laminate
Thermoset epoxy resin with alkali-free glass fiber. Ideal for high-frequency circuits and multilayer PCBs.
- • High dielectric strength
- • Excellent mechanical rigidity
- • Flame retardant (UL94 V-0)
Aluminum Copper Clad Laminate
High thermal conductivity substrate with aluminum base and conductive layer.
- • IPC standard compliant
- • Efficient heat dissipation
- • Used in high-power LED modules
CEM-3 Copper Clad Laminate
Composite substrate with glass cloth, glass mat, and epoxy resin.
- • Good drilling and punching performance
- • Suitable for double-sided PCBs
- • Cost-effective alternative to FR4
CEM-1 Copper Clad Sheet
Cellulose paper-based laminate with excellent punching properties.
- • Punchable at 45°C–75°C
- • Low moisture absorption
- • Economical for single-sided boards
FR4 Epoxy Glass Sheet
High-strength electrical insulator with superior mechanical durability.
- • High tensile strength
- • Excellent arc resistance
- • Used in switchgear and insulators
3240 Epoxy Fiberglass Sheet
High-performance insulating material with excellent thermal stability.
- • Operating temp up to 130°C
- • High flexural strength
- • Low dielectric loss
Electrolytic Copper Foil
High-purity copper foil for PCB manufacturing with uniform thickness.
- • Thickness: 12–70 μm
- • High peel strength
- • Smooth surface finish
High-Frequency CCL
Optimized for 5G, radar, and satellite communication systems.
- • Low Dk and Df values
- • Stable electrical performance
- • Minimal signal loss