Our Product Capabilities
We manufacture and assemble a wide range of PCBs for diverse industries with precision and reliability.
HDI PCB
Microvias, blind/buried vias, fine pitch components. Ideal for smartphones, medical devices, and compact electronics.
- • Laser drilling technology
- • Up to 12 layers HDI
- • Impedance control
- • RoHS compliant
Rigid-Flex PCB
Combines rigid and flexible substrates for 3D applications. Used in aerospace, automotive, and wearables.
- • Up to 64 layers
- • Dynamic flex capability
- • PI coverlay & adhesive
- • High reliability
High-Frequency PCB
Designed for RF, microwave, and 5G applications. Low signal loss and stable Dk/Df.
- • Materials: Rogers, Taconic, Isola
- • Frequency up to 100GHz
- • Controlled impedance
- • Thermal management
Multilayer PCB (Up to 64 Layers)
Complex routing for high-speed digital, power electronics, and industrial control systems.
- • 4 to 64 layers
- • Blind/buried vias
- • Sequential lamination
- • Thermal vias
SMT PCB Assembly
High-speed pick-and-place, reflow soldering, AOI, and X-ray inspection for precision surface mount technology.
- • 01005 to 2512 components
- • QFN, BGA, CSP packages
- • 15 SMT lines
- • 24-hour turnaround
Through-Hole (THT) Assembly
Wave soldering and manual insertion for high-reliability power and industrial applications.
- • Axial & radial components
- • Connectors, transformers
- • Mixed tech (SMT+THT)
- • High current handling
Prototype PCB
Fast-turn prototypes with DFM feedback. From idea to working board in days.
- • 24–72 hour turnaround
- • Free DFM analysis
- • 1–100 pcs
- • Online quoting
Full Turnkey Assembly
We source components, assemble, test, and ship ready-to-use boards. No hassle, no delays.
- • BOM management
- • Component procurement
- • Functional testing
- • Packaging & shipping