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Precision Grinding & Polishing Solutions

Advanced wafering, lapping, and polishing machines for semiconductor, optics, medical, and industrial applications. Engineered for ultra-precision, consistency, and performance.

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About Ponda Grinding

PONDA GRINDING specializes in the production of high-precision grinding, lapping, and polishing equipment and consumables. Our products are widely used in the precision machining of various industries, including semiconductors, optics, smartphone hardware, mechanical sealing, aerospace, aircraft, and automotive.

At Ponda, we have established a solid foundation of core technology, which gives us the confidence to engage with customers, academic institutions, and investors. Our commitment to innovation and quality ensures that every machine meets the highest standards of performance and reliability.

50+

Industrial Applications

15+

Years of Expertise

Ponda Wafer Grinder

Our Product Lineup

Discover our range of high-precision machines and consumables designed for wafering, lapping, polishing, and optical surfacing across multiple industries.

Semi-Automatic Wafer Grinder

Semi-Automatic Wafer Grinder

Ideal for R&D and small-batch production with high repeatability and precision control.

  • • Wafer sizes: 100–200mm
  • • Thickness control: ±1μm
  • • Air static bearing spindle
Fully Automatic Wafer Grinder

Fully Automatic Wafer Grinder

High-throughput solution for mass production environments with integrated automation.

  • • Supports 200–300mm wafers
  • • TTV < 0.5μm
  • • Fully programmable process
Wafer Wax Mounter

Fully Automatic Wafer Wax Mounter

Secure and uniform wax bonding for backgrinding processes.

  • • Uniform wax thickness
  • • High adhesion stability
  • • Compatible with thin wafers
Double Sided Lapping Machine

Double-Sided Lapping Machine

Achieve exceptional flatness and parallelism for sealing and optical components.

  • • Flatness: < 0.5μm
  • • High material removal rate
  • • Programmable pressure control
Wafer Grinding Wheel

Wafer Grinding Wheels

High-performance consumables engineered for long life and consistent results.

  • • Diamond abrasive
  • • Customizable grit size
  • • For Si, SiC, GaAs, and glass
Lapping Discs & Slurry

Lapping Discs & Slurry

Optimized consumables for single and double-sided lapping processes.

  • • Various hardness levels
  • • High slurry efficiency
  • • Low surface defect rate
Dual Spindle Optical Grinder

Dual Spindle Optical Grinder

Precision grinding for spherical and aspherical lenses with five-axis control.

  • • 5-axis CNC control
  • • Sub-micron accuracy
  • • For glass and crystal optics
Wafer Lapping & CMP Polishing Machine

Wafer Lapping & CMP Polishing Machine

Integrated solution for defect removal and mirror-like surface finishes.

  • • Combined lapping & polishing
  • • Low surface roughness (Ra < 0.5nm)
  • • Automated slurry delivery
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Advanced Processing Techniques

Pushing the boundaries of precision with cutting-edge grinding and polishing technologies.

Ultra-thin Wafer Grinding

Process wafers as thin as 5 microns with minimal warpage and high yield.

TAIKO Ringed Wafer Grinding

Secure handling of ultra-thin wafers using edge ring support to prevent breakage.

Air Static Bearing Spindle

Axial runout as low as 0.05 micron for vibration-free, ultra-precise grinding.

Five-Axis Control Program

For complex aspheric and freeform optical surface generation.

Industry Applications

Our precision grinding and polishing solutions serve a wide range of high-tech industries.

Semiconductor

Optics

Sealing

Measurement

Medical

Vehicle

Electronic Device

Mechanism

Energy

Contact Us for Custom Solutions

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Have technical or commercial questions? Want to request samples or documentation?

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