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Rocket PCB delivers high-quality PCB fabrication, HDI, rigid-flex, high-frequency, and turnkey assembly services since 2002. No MOQ, fast turnaround, and expert engineering support for complex designs.
Are you struggling to find a reputable high-end PCB maker in China? Constantly changing suppliers due to limited capacity, quality issues, and subpar service is frustrating.
When you need complex PCBs like high multilayer PCB, HDI PCB, high frequency & high-speed PCB, rigid-flex & flex PCB, thick copper, hybrid material, thermal management, metalcore, backplane, embedded components, IC substrate, ceramic base, wire bonding, special size and unique requirements, factory minimums become a barrier. However, Rocket PCB breaks these barriers. With no MOQ, you can get high-quality PCBs. Our expertise handles your toughest PCB fabrication projects. More importantly, we can be involved in the project from the beginning of the schematic design, hardware scheme design, and high-frequency and high-speed design, to SI/PI simulation, manufacturing, and testing services — a truly one-stop integrated electronic service platform.
High-speed PCB design, SI/PI/EMC simulation, schematic services for ARM, FPGA, and mixed-signal systems.
Fast, low-cost prototyping with no minimum order quantity.
Complex fabrication for HDI, hybrid, thermal, and embedded PCBs.
Complete assembly with component sourcing, DFM, and testing.
From simple single-layer to complex HDI and rigid-flex, we manufacture a full range of PCB types with precision and reliability.
1–64 layers, high-density interconnects, ideal for complex electronics in industrial and communication systems.
High-Density Interconnect with microvias, fine lines, and buried/blind vias for compact, high-performance devices.
Combines rigid and flexible substrates for 3D packaging, ideal for aerospace, medical, and wearable tech.
Ultra-thin, bendable circuits for dynamic applications. Supports high-frequency and high-speed signals.
Up to 20oz copper, excellent for power electronics, motor drives, and thermal management applications.
Metal-core PCB with excellent heat dissipation. Ideal for LED lighting, power supplies, and automotive systems.
Designed with Rogers, Taconic, Arlon materials for 5G, radar, satellite, and microwave applications.
High thermal conductivity, low CTE. Used in power modules, LED, and advanced IC packaging.
We support the most demanding PCB technologies and materials for high-reliability applications.
Allows direct component mounting over vias, improving signal integrity and space utilization.
Laser-drilled microvias for HDI and high-density routing in compact devices.
Laser Direct Imaging ensures high precision and fine line/space down to 2.5 mil.
Precise impedance matching for high-speed digital and RF circuits.
Removes stubs in high-speed vias to reduce signal reflection and crosstalk.
Passives or actives embedded within PCB layers for miniaturization and reliability.
Rocket PCB has over 20 years of rich production experience in PCB fabrication and electronics manufacturing. We serve clients in communication, industrial control, automotive, server, security, and more.
Our commitment to quality, fast turnaround, and engineering excellence has made us a preferred partner for R&D teams and OEMs worldwide.
For quotes, technical support, or project consultation, reach out to our team.
Email: [email protected]
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