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Huizhou Runtek Co., Ltd. delivers high-reliability, high-tech PCB solutions with minimal resource consumption. Trusted by global innovators in telecommunications, IoT, and industrial electronics.
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Runtek always holds the concept of “providing high-tech and high reliable PCB and service for the sustainable development of electronic technology with minimal resource consumption”. We continue to strengthen R&D, enhance product competitiveness, and invest in advanced equipment to improve automation, efficiency, and production capacity.
Runtek leverages cutting-edge technology and precision engineering to deliver PCBs that meet the highest standards in performance and reliability.
0.075mm drill diameter with four-laser shots per hole ensures unmatched accuracy and reliability.
Advanced build-up HDI technology for compact, high-performance electronics in 5G, IoT, and mobile devices.
Up to 30μm copper thickness for high-current applications in industrial control and power systems.
Precision-controlled signal integrity for high-speed communication and RF applications.
Custom flexible and rigid-flex PCBs for space-constrained and high-mobility applications.
Low-cost, fast-turn prototypes under IPC-2 standards — ideal for R&D and product validation.
Customized, high-reliability PCBs for diverse high-tech industries.
High-Density Interconnect PCBs with microvias, ideal for smartphones, IoT modules, and 5G base stations.
High Aspect Ratio PCBs for high-layer-count applications requiring deep drilling precision.
Via on Pad technology for compact, high-density routing in advanced HDI designs.
Panelized PCBs with stamp-hole breakaway for efficient assembly and handling.
Plated Through-Hole PCBs for mixed-technology assemblies and rugged applications.
Controlled impedance PCBs for high-speed digital and RF signal transmission.
Hybrid rigid and flexible circuits for compact, dynamic applications.
High-current power boards with thick copper layers for thermal and electrical performance.
HDI (High-Density Interconnect) PCBs use microvias, fine lines, and high layer density to enable smaller, faster, and more reliable electronic devices. They are essential for smartphones, IoT, and 5G technologies.
Yes, Runtek offers precision impedance-controlled PCBs with tight tolerances, ideal for high-speed digital and RF applications such as servers, optical modules, and 5G base stations.
We support FR-4, HF (high-frequency) materials like Rogers, polyimide for flex, and metal-core substrates. Material selection is optimized for frequency, thermal, and mechanical requirements.
Standard prototype lead time is 5–7 days. Fast-turn options are available. Production lead times vary based on complexity and volume.
Yes, our engineering team provides free Design for Manufacturing (DFM) analysis to ensure your design is optimized for yield, reliability, and cost-efficiency.
You are welcome to visit our factory or share your custom requirements. We respond to all inquiries within 12 hours.
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