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Be a Global Leader in Precision & Technology

API is a global manufacturer of high-technology equipment, specializing in precision pick & place and advanced packaging solutions for semiconductor back-end and micro-component assembly.

Explore Our Solutions

About API

A global leader in precision pick & place technology, dedicated to advancing semiconductor packaging and intelligent manufacturing.

Who is API?

API is a global manufacturer of high-technology equipment, specializing in precision pick & place and advanced packaging solutions for semiconductor back-end and micro-component assembly. Our service network spans Singapore, the United States, Japan, China, and other countries, offering comprehensive technical support and considerate services worldwide.

API's core technical and management team is comprised of seasoned experts from leading global semiconductor companies, each possessing 10 to 30 years of industry experience. Driven by our professional founding team, cutting-edge product technology, and mature solutions, we deliver superior quality and service that have been recognized by top-tier semiconductor OSATs, IDMs, and CMIs both domestically and internationally.

Semiconductor Packaging Equipment
2,052,000+
Dies We Bonded
1,000+
Machines Running in Field
84+
Months Equipment Stabilization

Our Mission & Vision

Mission

Facilitate upgrading global precision intelligent manufacturing.

Concept

Everything is focused on customers.

Core Technologies

We strive to provide high-end equipment and precision packaging solutions for electronic micro devices and chip devices.

Precision Mechanical Design

Advanced structural engineering for ultra-stable, high-accuracy motion systems.

Software Framework Platform

Robust, scalable software architecture enabling real-time control and data analytics.

Vision Framework/Algorithm

High-speed, sub-micron alignment and inspection using advanced imaging algorithms.

Motion Control Technology

Ultra-precise, high-speed motion systems with nanometer-level repeatability.

CAE Simulation Technology

Thermosetting flow simulation and structural analysis for optimal process design.

High Performance Motor Technology

Custom-designed motors for maximum torque, speed, and precision in compact form.

Our Products

Be a Global Leader in Precision Pick and Place Technology

AP-M3500 Series

AP-M3500 Series

Multi-Chip SiP Die Bonder

  • • High-precision multi-chip stacking
  • • Advanced alignment for SiP packaging
  • • Optimized for high-volume manufacturing
AP-M2000 Series

AP-M2000 Series

Ultra-Thin-Die Stacking Bonder

  • • Designed for ultra-thin die applications
  • • Sub-micron placement accuracy
  • • High throughput for advanced packaging
AP-Smart Inline

AP-Smart Inline

Semiconductor Packaging Intelligent Inline Solution

  • • Fully integrated inline processing
  • • Real-time monitoring and control
  • • AI-driven optimization for yield improvement
Advanced Packaging Solution

AP-Advanced Module Bonder

High-Density Multi-Chip Module Packaging

  • • Precision placement for complex modules
  • • Thermal compression bonding
  • • Supports heterogeneous integration
Precision Equipment

AP-Fine-Pitch Bonder

Sub-40μm Pitch Die Attach System

  • • Ultra-fine pitch capability
  • • Low-stress bonding process
  • • High yield for advanced nodes
Packaging Equipment

AP-Wafer-Level Bonder

Full Wafer-to-Wafer and Wafer-to-Substrate Bonding

  • • High-uniformity bonding across full wafer
  • • Advanced pressure and temperature control
  • • Compatible with multiple bonding technologies
Smart System

AP-VisionPro System

High-Speed Alignment and Inspection Platform

  • • Sub-micron alignment accuracy
  • • Real-time defect detection
  • • Machine learning-based classification
Motion Control

AP-MotionCore Platform

Next-Gen Motion Control Architecture

  • • Nanometer-level repeatability
  • • High-speed trajectory planning
  • • Vibration suppression algorithms

Why Choose API?

1
Headquarter
5
R&D Centers
2
Global Innovation Centers
100+
Patents

Latest News

SEP
18

SEMICON Taiwan 2025 | Successfully Concluded

SEMICON Taiwan 2025 has come to a successful close, and API’s journey in Taipei wrapped up with recognition, achievements, and new opportunities.

SEP
04

This September, riding the AI wave — API will shine at CIOE & SEMICON Taiwan (Sep 10–12, 2025)

API is proud to announce its participation in two major industry events this September, showcasing our latest innovations in semiconductor packaging technology.

JUN
18

Precision Integration, Ecosystem Collaboration: API Empowers Singapore’s Semiconductor Ecosystem Development

API continues to strengthen its role in Singapore's growing semiconductor ecosystem through strategic partnerships and technology innovation.

Contact API

Get in touch with our team for inquiries, partnerships, or technical support.

Address

Blk 55 Ayer Rajah Crescent #01-26, Singapore 139949

Phone

+65 9349 9866 (Bert)

Email

[email protected] / [email protected]

Visit Official Website
China Quality Suppliers fobcompany.info

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