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Precision HDI PCBs for Tomorrow's Tech

Shenzhen Precision Electronics Co., Limited delivers high-complexity, low-to-medium volume, and rapid-turn HDI PCBs with micro-via any-layer, 4+N+4 stacking, and advanced multilayer designs for AI, 5G, aerospace, and medical systems.

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Engineered for Complexity

Since 1998, our factory has been committed to delivering high-performance Printed Circuit Boards. We specialize in High Density Interconnection (HDI), Flexible Printed Circuits (FPC), and Integrated Circuit Substrates (ICS) for mission-critical applications.

Shenzhen Precision Electronics Co., Limited focuses on high-complexity, low-to-medium volume, and quick-turn HDI PCBs — including 3+N+3, 4+N+4, 5+N+5, and micro-via any-layer technologies. Our advanced manufacturing capabilities have earned trust from leading global telecommunications, aerospace, and medical equipment manufacturers.

  • 25+ Years of Precision Manufacturing
  • Strategic Partnerships with Global Leaders
  • ENIG, Gold Finger & High-Reliability Finishes
HDI PCB Manufacturing

Advanced Product Portfolio

From Qualcomm Snapdragon to Canon Phoenix and Esperanto AI platforms, our boards are engineered for performance, reliability, and signal integrity in the most demanding environments.

Qualcomm 12L Snapdragon Board

Qualcomm 12L (4+4+4) Snapdragon Board

High-density interconnect SOM for mobile and edge computing platforms.

Layers: 12L (4+4+4)

Surface: ENIG

Application: Snapdragon SoC Integration

Canon 12L Phoenix SOM Board

Canon 12L (4+4+4) Phoenix SOM Board

Custom carrier for Canon’s high-performance embedded vision systems.

Layers: 12L (4+4+4)

Surface: ENIG

Application: Industrial Imaging & Automation

Esperanto 14L Bring Up Board

Esperanto 14L (4+6+4) Bring Up Board

Validation platform for RISC-V AI accelerators with ultra-fine routing.

Layers: 14L (4+6+4)

Surface: ENIG

Application: AI/ML Hardware Development

12L High Complicated AnyLayer

12L High Complicated AnyLayer

True any-layer micro-via structure for maximum routing density and signal integrity.

Layers: 12L AnyLayer

Min Line/Space: 0.058mm / 0.06mm

Surface: ENIG

Qualcomm 10L Snapdragon Flight

Qualcomm 10L Anylayer Snapdragon Flight

Compact HDI board for drone and UAV control systems.

Layers: 10L Anylayer

Surface: ENIG

Application: Autonomous Flight Systems

Qualcomm 8L Carrier Board

Qualcomm 8L (1+6+1) Carrier Board

Robust base for modular Snapdragon compute modules.

Layers: 8L (1+6+1)

Surface: ENIG

Application: Embedded Computing

8L (2+4+2) HDI Board

Balanced stack-up for high-speed digital and RF applications.

Layers: 8L (2+4+2)

Thickness: 1.2 ±10%

Line/Space: 0.069mm / 0.075mm

Surface: ENIG

10L (2+6+2) with Gold Finger

High-reliability board with edge connector for rugged environments.

Layers: 10L (2+6+2)

Gold Finger: Au ≥ 0.76μm

Line/Space: 0.075mm / 0.075mm

Surface: ENIG

12L (Anylayer) Ultra-Fine

Cutting-edge routing with 0.058mm line/space for next-gen processors.

Layers: 12L Anylayer

Thickness: 1.0 ±10%

Line/Space: 0.058mm / 0.06mm

Surface: ENIG

8L (Anylayer) Compact HDI

Thin-profile design ideal for space-constrained consumer electronics.

Layers: 8L Anylayer

Thickness: 0.8 ±10%

Line/Space: 0.068mm / 0.1mm

Surface: ENIG

Core Manufacturing Capabilities

Engineered for complexity, precision, and reliability in every layer.

HDI & Micro-Via Any-Layer

Advanced 3+N+3, 4+N+4, and 5+N+5 stacking with blind/buried vias and true any-layer micro-via routing for maximum density.

Flexible & Rigid-Flex PCBs

High-reliability FPC and rigid-flex solutions for compact, dynamic, and high-movement applications in medical and aerospace.

High-Reliability Finishes

ENIG, immersion silver, and gold finger plating (Au ≥ 0.76μm) for long-term durability and signal integrity.

25+
Years of Experience
4+N+4
Max HDI Stack-up
0.058mm
Min Line/Space
Global
Client Base

Frequently Asked Questions

What is HDI PCB technology?

HDI (High Density Interconnection) PCBs use finer lines, smaller vias, and higher layer counts to achieve greater functionality in a smaller footprint. They are essential for smartphones, AI hardware, and advanced embedded systems.

What does '4+N+4' mean in HDI stack-up?

A 4+N+4 stack-up refers to a PCB with 4 outer sequential lamination layers on both sides of a core (N layers). This allows for multiple layers of micro-vias, enabling complex routing in high-pin-count ICs like SoCs and FPGAs.

Do you support quick-turn prototypes?

Yes. We specialize in low-to-medium volume and rapid-turn HDI PCBs, ideal for engineering validation, bring-up, and NPI phases.

What industries do you serve?

Our boards are used in telecommunications, AI/ML hardware, aerospace, medical devices, automotive systems, and high-end consumer electronics.

Ready to Build the Future?

Partner with Shenzhen Precision Electronics for high-complexity HDI and any-layer PCBs engineered for performance and reliability.

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