PCB R&D - Production - Sales | Shenzhen Tongsheng Technology Co., Ltd

About Shenzhen Tongsheng Technology

A leading high-tech enterprise in PCB design, manufacturing, and sales, committed to innovation, quality, and customer satisfaction.

Established in 2005, Shenzhen Tongsheng Technology Co., Ltd is a professional PCB manufacturer with over 400 skilled workers and a strong focus on R&D, production, and global sales. We specialize in high-complexity, high-reliability printed circuit boards for mission-critical applications across aerospace, medical, automotive, power, and semiconductor industries.

Our advanced manufacturing capabilities include ultra-thick copper processing, high-Tg materials, blind and buried vias, rigid-flex integration, and impedance-controlled designs. With a commitment to quality and rapid turnaround — including 24-hour delivery options — we empower our clients to accelerate innovation and time-to-market.

ISO & IPC Certified Manufacturing
24-Hour Express Delivery Option
Over 19 Years of Industry Experience
Global Customer Base in 30+ Countries

Our PCB Products

Engineered for performance, reliability, and precision — our PCBs meet the highest standards across industries.

Multilayer PCB

High-density interconnects with up to 32 layers, ideal for complex digital systems requiring compact design and high-speed signal integrity.

• 4 to 32 layers
• Impedance control
• High Tg materials
• Lead-free assembly

High Frequency PCB

Optimized for RF, microwave, and high-speed digital applications with low dielectric loss and stable electrical performance.

• Rogers, Teflon, Arlon materials
• Low Dk/Df
• Controlled impedance
• 5G, radar, satellite comms

High Tg Heavy Copper PCB

Designed for high-power applications with thermal stability and current-carrying capacity using 1–6 oz copper layers.

• 1–6 oz copper
• High thermal conductivity
• Metal-core options
• Power converters, EVs

Buried & Blind Via PCB

Advanced interconnect technology for HDI designs, enabling miniaturization and improved signal integrity in compact electronics.

• Microvia technology
• Sequential lamination
• Disc hole & half-hole options
• Ideal for IoT & wearables

Rigid-Flex PCB

Combines rigid and flexible substrates for 3D packaging, reducing interconnects and improving reliability in dynamic environments.

• Polyimide flex layers
• Dynamic bending capability
• Medical & aerospace grade
• Space-saving integration

Backplane PCB

High-layer-count, large-format boards for data centers, telecom, and industrial systems requiring robust signal and power distribution.

• Up to 60 layers
• Long gold fingers
• Back-drilling for signal integrity
• High-reliability connectors

Impedance Controlled PCB

Precision-controlled trace geometry and dielectric spacing for consistent signal performance in high-speed digital and RF circuits.

• ±5% tolerance
• Differential pairs
• TDR testing
• DDR, PCIe, USB 3.0+

High-Reliability PCB

Engineered for extreme environments with enhanced materials, coatings, and process controls for aerospace, defense, and medical use.

• Conformal coating
• ENIG/Immersion Silver
• Strict IPC Class 3
• Full traceability

Industries We Serve

Our PCBs are trusted in mission-critical applications where performance, durability, and precision are non-negotiable.

Power & Energy

• Ultra thick copper process
• High thermal conductivity substrates
• Metal-based cores
• 1–6 oz thick copper multilayer

Wearables & IoT

• High-level multilayer capability
• Accurate impedance control
• Special materials & mixed media
• Gold fingers, back drill

Semiconductor

• Module manufacturing experience
• 24-hour delivery capability
• Blind/buried via tech
• Disc & half-hole technology

Avionics & Aerospace

• Stable, reliable quality
• Special structured PCBs
• Environmental adaptability
• High-reliability standards

Medical & Instrumentation

• Small size, high precision
• Fine-pitch capabilities
• Biocompatible finishes
• ISO 13485 compliant processes

Automotive & Transportation

• High reliability control
• EV R&D support
• Strict process & traceability
• AEC-Q200 compliant options

Technical Capabilities

Backed by advanced equipment, rigorous certifications, and deep process expertise.

Advanced Technology

HDI, microvias, sequential lamination, impedance control, back drilling, and specialty finishes for complex designs.

Process Capability

Layer count up to 60, trace/space down to 3/3 mil, blind via down to 0.1mm, and backplane sizes up to 24"x24".

Certifications

ISO 9001, IATF 16949, IPC Class 2 & 3, RoHS, and REACH compliant. Full traceability and quality assurance.

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Precision PCB Manufacturing for Demanding Industries