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Shenzhen Viafine PCB Co., Ltd delivers high-quality multilayer, HDI, Flex-Rigid, and high-frequency PCBs with fast turnaround and exceptional reliability. Trusted by aerospace, medical, automotive, and industrial leaders worldwide.
Shenzhen Viafine PCB Co., Ltd is a leading manufacturer specializing in advanced printed circuit boards for high-tech industries. With a strong focus on quality, innovation, and customer satisfaction, we serve global clients in telecommunications, power supply, industrial control, medical instruments, automotive systems, aerospace, and defense.
Our expertise spans FR4, multilayer PCBs, special materials, Flex-Rigid PCBs, and HDI technology. We are certified under UL and ISO9001 standards, ensuring every product meets rigorous international requirements.
We manufacture a wide variety of high-performance PCBs using premium materials and cutting-edge processes. From standard FR4 to exotic high-frequency laminates, Viafine delivers precision and reliability.
High-density interconnect with ENIG finish. Ideal for telecom and industrial control applications requiring EMI resistance and durability.
High-Density Interconnect boards with microvias and fine lines. Perfect for compact consumer electronics and mobile devices.
Single-sided high-frequency board with excellent thermal stability. Used in RF and microwave applications.
Standard FR4 construction with lead-free HASL finish. Cost-effective solution for prototypes and low-volume production.
Immersion gold finish with blue solder mask. Offers superior wire bonding and long-term reliability for medical and automotive systems.
High-frequency laminates including RT6002, RT5880, RO3210, RO3006, and RO3003. Ideal for radar, 5G, and satellite communications.
Aluminum or copper base for superior thermal management. Commonly used in LED lighting and power electronics.
Specialty high-frequency materials for extreme environments. Used in aerospace, defense, and high-reliability systems.
High glass transition temperature with thick copper layers (up to 20oz). Designed for high-current power supplies and industrial equipment.
Hybrid construction combining rigid and flexible substrates. Enables compact 3D packaging for aerospace and medical devices.
Combines FR4 with Rogers or other high-frequency materials in a single stack-up. Optimizes performance and cost in RF-digital hybrids.
Fast turnaround from 24 hours. Ideal for R&D, testing, and low-volume production. Supports all types including HDI and Flex-Rigid.
Our state-of-the-art facilities and experienced engineering team enable us to deliver complex PCBs with tight tolerances and high reliability.
Up to 20+ layers with precise impedance control, blind/buried vias, and sequential lamination. Ideal for complex digital and RF designs.
Expertise in Rogers, Taconic, Isola, Panasonic, and Dupont laminates. Precision etching and lamination for stable RF performance.
High glass transition temperature (Hi-Tg) materials and copper weights up to 20oz. Excellent for thermal management and power applications.
Laser drilling, microvias, and fine lines/pads down to 3/3 mil. Enables miniaturization and high pin-count BGA routing.
Seamless integration of rigid and flexible circuits. Supports dynamic flexing and 3D packaging for space-constrained designs.
UL certified, ISO9001 compliant. Strict quality control from incoming materials to final inspection and testing.
Viafine specializes in multilayer PCBs, HDI, Flex-Rigid, metal base (aluminum/copper), high-Tg heavy copper, and high-frequency PCBs using materials like Rogers, Taconic, Isola, and Dupont.
We are UL certified and ISO9001 compliant, ensuring our manufacturing processes meet international quality standards.
Our PCBs are used in telecommunications, power supply, industrial control, medical instruments, automotive, aerospace, defense, and consumer electronics.
Yes, we provide fast turnaround services starting from 24 hours for prototypes and small-volume production runs.
We operate two advanced factories: one in Shenzhen (Baoan District) and another in Dongguan (Changan Town).
Yes, we have extensive experience in fabricating mixed dielectric stack-ups, such as combining FR4 with Rogers materials for optimized RF-digital integration.
Ready to start your next project? Contact Viafine PCB today for a quote, technical consultation, or sample request.
Room 305, Fujing Maker Center
No. 86, Yangxia Avenue
Shajing Street, Baoan District
Shenzhen, China
4th Floor, Pingsheng Industry Park
Pingzhi Road, Changan Town
Dongguan City, China
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