Featured Products
High-performance test sockets designed for accuracy, durability, and signal integrity across a wide range of IC packages.
BGA 218pin-0.5mm-9.15×9.15mm
High-density BGA test socket with 0.5mm pitch, ideal for compact ICs in mobile and IoT devices.
- Pin Count: 218
- Pitch: 0.5mm
- Package Size: 9.15×9.15mm
- Application: High-speed digital ICs
BGA 72pin-1.0mm-12x12mm
Reliable BGA socket for mid-density applications with excellent thermal and electrical performance.
- Pin Count: 72
- Pitch: 1.0mm
- Package Size: 12×12mm
- Application: Power management ICs
BGA 218pin Test Socket (High Cycle)
Engineered for over 20,000 mating cycles. Perfect for production line testing.
- Life Cycle: >20,000 insertions
- Material: High-temp engineering plastic
- Compliance: RoHS, ISO9001
BGA 218pin-0.5mm (Low Insertion Force)
Optimized for sensitive devices requiring minimal mechanical stress during testing.
- Pitch: 0.5mm
- Insertion Force: <15N
- Signal Integrity: High bandwidth
SOP 24pin-1.52mm-(21×11.7mm)
Burn-in test socket for SOP packages with stable contact and high thermal resistance.
- Pin Count: 24
- Pitch: 1.52mm
- Size: 21×11.7mm
- Temp Range: -55°C to +150°C
QFN 20pin-0.5mm-3.5×3.5mm
Compact QFN socket for ultra-small footprint ICs in wearables and sensors.
- Pitch: 0.5mm
- Size: 3.5×3.5mm
- Package Type: Quad Flat No-leads
- Use Case: Low-power microcontrollers
Custom BGA & LGA Sockets
Tailored solutions for non-standard pitch, size, or high-frequency requirements.
- Customization: Full design support
- Lead Time: As fast as 2 weeks
- Prototyping: Available
PCB Burn-in Boards
Multi-site burn-in boards with thermal management and signal monitoring capabilities.
- Sites: 4 to 32
- Compatibility: Standard ovens & testers
- Design: Impedance-controlled traces